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  • IC697CHS770 redundant rack
  • IC697CHS770 redundant rack
  • IC697CHS770 redundant rack
IC697CHS770 redundant rack IC697CHS770 redundant rack IC697CHS770 redundant rack

IC697CHS770 redundant rack

IC697CHS770 redundant rack  

Product Details Introduction

IC697CHS770 is a 17 slot rear mounted redundant rack from GE Fanuc 90-70 series, designed specifically for dual CPU hot standby redundancy, high reliability, and high-density I/O systems. It is the core hardware platform for building 90-70 high availability control systems.

1、 Core architecture and specifications

Slot configuration: 17 standard slots, adopting a dual partition redundant architecture (2 independent backboards), each group containing 6 I/O slots and 1 power slot, a total of 12 I/O slots and 2 power slots.

Installation method: Rear Mount, suitable for 19 inch standard cabinets, with a depth of 10 inches (254mm), saving space in front of the cabinet.

Power supply capacity: maximum backplane 20A@5VDC Support dual power redundancy (IC697PWR series), single power failure does not affect system operation.

Compatible modules: The full range of IC697 modules (CPU, I/O, communication, dedicated function cards) are compatible with VME bus modules.

Physical parameters: Industrial grade metal structure, wide temperature operation (0-60 ℃), supports forced air cooling (optional fan components).

2、 Redundancy and high availability features

Dual partition independent backplane: Two sets of backplane are electrically isolated to achieve full link redundancy of CPU+I/O+power supply, eliminating single point failures.

Hot standby redundancy support: In conjunction with redundant CPUs such as IC697CGR935 and IC687 redundant communication modules, achieve interference free switching (within a single scanning cycle).

Hot swappable design: All modules support online plugging and unplugging, ensuring uninterrupted production maintenance.

Power redundancy: Dual power slots, supporting N+1 redundancy, automatic power failure switching, no power interruption.

3、 Communication and Expansion Capability

High speed backplane: VME bus architecture, low latency communication between modules, suitable for high-speed control and large data volume I/O.

Distributed Expansion: Build a large-scale distributed control system by cascading Genius bus and remote I/O modules.

Multi protocol compatibility: Supports industrial communication protocols such as SNP, Modbus, Ethernet, etc., and is compatible with third-party devices.

4、 Wiring and maintenance design

Bottom incoming line: Bottom wiring cavity, high-density cable management, reducing interference inside the cabinet.

Independent grounding system: Built in grounding terminal to enhance EMC performance and system safety.

Status indication: Power supply, backplane, communication status LED, quickly locate faults.

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