LAM 839-019090-611 electrostatic clamp

LAM 839-019090-611 electrostatic clamp

Product Details Introduction

LAM 839-019090-611 is an electrostatic chuck (ESC) used in semiconductor manufacturing equipment, mainly for fixing and temperature control during wafer processing. The following are its characteristics and application areas:

Main features:

Electrostatic adsorption

Use electrostatic force to firmly fix the wafer and avoid damage caused by mechanical clamping.

Accurate temperature control

Built in heating and cooling system for precise control of wafer temperature.

high reliability

Designed for high vacuum and plasma environments, with long lifespan and stable performance.

Compatible with multiple sizes

Supports wafers of different sizes (such as 200mm, 300mm) to meet various process requirements.

Low Pollution

Made with high-purity materials to reduce wafer contamination.

quick response

Fast temperature regulation response speed, suitable for high-precision process requirements.

Easy to integrate

Design in accordance with semiconductor equipment standards for easy installation and maintenance.

Application areas:

Semiconductor Manufacturing

Used for processes such as etching, chemical vapor deposition (CVD), physical vapor deposition (PVD), etc.

Flat panel display manufacturing

Used for thin film deposition and etching in the production of liquid crystal displays (LCDs) and organic light-emitting diodes (OLEDs).

Manufacturing of solar cells

Used for thin film deposition and surface treatment of photovoltaic cells.

Optical Coating

Coating process for optical lenses and filters.

Research and Laboratory

Support research in materials science and semiconductor processes.

Summary:

LAM 839-019090-611 electrostatic clamp is a high-precision and highly reliable wafer fixing and temperature control device, widely used in semiconductor manufacturing, flat panel display manufacturing, solar cell manufacturing, optical coating, and scientific research fields, meeting the needs of high-precision processes.

Product imag

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