Home > Product > DCS control system > LAM 853-227247-001 Robot Kit

  • LAM 853-227247-001 Robot Kit
  • LAM 853-227247-001 Robot Kit
  • LAM 853-227247-001 Robot Kit
LAM 853-227247-001 Robot Kit LAM 853-227247-001 Robot Kit LAM 853-227247-001 Robot Kit

LAM 853-227247-001 Robot Kit

  • Goods status: new/used
  • Delivery date: stock
  • The quality assurance period: 365 days
  • Phone/WhatsApp/WeChat:+86 15270269218
  • Email:stodcdcs@gmail.com
  • Tags:
  • Get the latest price:Click to consult

LAM 853-227247-001 Robot Kit

Product Details Introduction

The LAM 853-227247-001 robot kit is mainly used in the semiconductor manufacturing field, especially in wafer processing, to achieve precise and efficient automated wafer transfer. It is an important component in Lam Research equipment, suitable for both Front End and Back End processes, ensuring high precision and reliability in the production process.

Product application areas

Semiconductor Manufacturing (Wafer Processing)

Lithography: In the photolithography process, the wafer needs to be accurately fed into the lithography machine and removed to ensure alignment and lossless transmission.

Etching: Used for plasma etching (such as Lam Research 9400, TCP 9600, Versys, etc.) to accurately transport wafers and avoid particle contamination.

Deposition: Suitable for chemical vapor deposition (CVD), atomic layer deposition (ALD), and physical vapor deposition (PVD) equipment to ensure uniform processing.

Ion implantation: Sending wafers from a transport system into an ion implantation machine to ensure precise alignment and improve process control capabilities.

Cleaning: Cooperate with cleaning equipment (such as SPTS Omega series) to safely handle ultra-thin wafers and prevent damage.

Flat Panel Display (FPD)

Suitable for manufacturing OLED, LCD, and MicroLED panels, ensuring precise transmission of large-sized glass substrates and preventing scratches and dust pollution.

Advanced Packaging

Used for automated handling of wafer level packaging (WLP), flip chip, and other production lines in 2.5D and 3D IC packaging processes.

Other high-precision automation

Optical communication MEMS、 Power semiconductor manufacturing: supports high-precision chip transmission and is suitable for special processes of materials such as SiC and GaN.

Laboratory automation: used for scientific research equipment, providing precise sample handling solutions.

Main advantages

High precision transmission (nanometer level alignment accuracy, avoiding wafer damage)

Clean and dust-free design (compliant with Class 1 standard for semiconductor cleanrooms)

High throughput (improving wafer handling speed and increasing production capacity)

Compatible with Lam Research equipment (suitable for core processes such as Lam etching and deposition)

Product imag

65d35e6f4a9689ec6d639e3fd9071d45_1-25022Q35319159.jpg

Related website links

Kollmorgen 6SM37M-6000 servo motor

Radisys ATCA-PP81 controller module

AMAT 0190-24282 encoder module

Other website links

ASEA O-51831-6电流电压互感器

BENTLY 1900/55 190055-0Z-01-01-01地震监测模块

ABB GVC707AE01励磁IGCT可控硅

PFEL1136SC6000-0NA02MC-PDOY22 80363975-150
PFEL1116SC6140-0FE01MC-PD1X02
PFEA1136SC6500-0UC01MC-TAIL02
PFEA1126SC6100-0GA00MC-TAIL12
PFEA1116SC6120-0FE00MC-TAIH02
PFEA1016SC6101-2B-ZMC-TDODI3
PFCL301E6SC6100-0GA11MC-TAIH22
PFCL201CE6SC6140-0FE00MC-PC1X02
PFCL201C/CD6SC6100-0NA01MC-PAOY22


Obtain the latest price of LAM 853-227247-001 Robot Kit