0190-42550 RF Matching Network Device

0190-42550 RF Matching Network Device 

Product Details Introduction

Core positioning

AMAT (Applied Materials) original 0190-42550 RF matching network device, the core function is to achieve precise impedance matching between 13.56MHz RF power supply and plasma load, convert load impedance into standard 50 Ω output impedance, maximize high-frequency energy transmission efficiency, designed specifically for semiconductor manufacturing plasma processes, and is a key core component to ensure stable energy transmission in etching and sputtering equipment.

Core product features

Targeted adaptation to a fixed frequency band of 13.56MHz, supporting up to 2.5KW power transmission, precise standing wave ratio control, effectively reducing energy reflection loss, and ensuring process stability; Integrated fully automatic impedance matching function, fast response speed, dynamic tracking of load impedance changes and real-time adjustment, without the need for manual intervention; Adopting CV/MAT specific design standards, it is seamlessly compatible with plasma equipment and does not require additional adaptation or modification; Industrial grade reinforced structure with strong electromagnetic interference resistance, suitable for complex working conditions in semiconductor clean workshops, and high long-term operational stability.

Quick overview of key features

Specification parameters: Operating frequency of 13.56MHz, maximum output power of 2.5KW, compatible with 50 Ω standard system impedance; Compact modular structure, suitable for integrated installation of semiconductor equipment

Interface configuration: including dedicated RF input/output interface, device control signal interface, and status diagnosis port, supporting linkage control with AMAT RF power supply

Reliability: Through original factory functional testing, it has triple protection mechanisms for overcurrent, overvoltage, and overheating, easy maintenance, and meets the long-term service standards of the semiconductor industry

Application scenarios

Typical scenarios: semiconductor wafer etching process, thin film sputtering deposition equipment, plasma surface treatment system, AMAT dedicated semiconductor manufacturing equipment supporting

Core value: Improve the efficiency of RF energy transmission, ensure the success rate and process uniformity of plasma ignition, reduce equipment failure downtime, and assist in the high-precision and high stability operation of semiconductor manufacturing processes

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