853-064887-061 RF Matcher

853-064887-061 RF Matcher 

Product Details Introduction

Core positioning

The industrial grade 853-064887-061 RF matching device is designed to achieve precise impedance matching between RF power supply and loads (such as plasma and sputtering targets), convert load impedance into power standard output impedance (usually 50 Ω), maximize RF energy transmission efficiency, and adapt to high-frequency power application scenarios such as semiconductor manufacturing, communication equipment, and plasma processes. It is a key component in reducing energy reflection in RF systems.

Core product features

Capable of high-precision impedance adjustment, with a standing wave ratio (SWR) of ≤ 1.5, effectively reducing energy reflection loss and ensuring stable operation of the RF system; Support broadband adaptation, compatible with mainstream RF power output frequencies, and meet the power transmission needs of different processes; Integrated real-time impedance monitoring and automatic matching function, fast response speed, can dynamically adapt to changes in load impedance; Industrial grade protection design, strong electromagnetic interference resistance, suitable for complex industrial environments such as high and low temperatures, and high dust, with a stable and durable structure.

Quick overview of key features

Specification parameters: Suitable for RF power transmission scenarios, high impedance matching accuracy, compatible with standard 50 Ω system impedance; Compact modular structure, suitable for integrated installation of standard cabinets or equipment

Interface configuration: including RF input/output interface, control signal interface, and status diagnosis port, supporting linkage control with RF power supply

Reliability: Through strict functional testing, it has overcurrent and overvoltage protection mechanisms, easy maintenance, high operational stability, and meets the long-term service requirements of industrial equipment

Application scenarios

Typical scenarios: semiconductor wafer etching/sputtering process, communication base station RF system, plasma processing equipment, radar transmission and reception system

Core value: Improve the efficiency of RF energy transmission, reduce equipment heating and downtime due to faults, ensure process stability (such as plasma ignition success rate and sputtering rate uniformity), and assist in the efficient operation of industrial production and communication systems

853-064887-061 Product imag

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