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  • 0190-06279 Printed Circuit Board
  • 0190-06279 Printed Circuit Board
0190-06279 Printed Circuit Board 0190-06279 Printed Circuit Board

0190-06279 Printed Circuit Board

0190-06279 Printed Circuit Board 

Product Details Introduction

0190-06279 Instructions for Printed Circuit Boards

0190-06279 is an industrial grade printed circuit board (PCB), which is the core carrier and interconnect component of electronic devices, suitable for industrial control, precision instruments and other scenarios

2. Using FR-4 epoxy glass cloth substrate, it has excellent insulation performance and mechanical support strength, suitable for complex industrial environments

3. The copper foil thickness adopts the standard 1oz (35 μ m), which ensures stable circuit conductivity and meets the power transmission requirements of industrial equipment

4. Adopting a multi-layer board design with high wiring density, it can achieve efficient interconnection of multiple components and optimize signal transmission paths

5. The solder mask layer adopts green insulation ink, effectively preventing circuit oxidation and welding short circuit, and improving the reliability of use

6. Clear labeling of component positions and parameter identification on the silk screen layer facilitates assembly, debugging, and later maintenance

7. The minimum line width/spacing is 4mil (0.1mm), and precision etching technology is used to ensure the accuracy of circuit connection and signal integrity

8. The precision of metalized hole diameter is ± 0.075mm, and the interlayer connection is reliable, reducing signal transmission loss

9. The working temperature range is -20 ℃ to 60 ℃, with strong environmental adaptability, and can operate stably in conventional industrial workshops and laboratories

10. Possess good resistance to electromagnetic interference, optimized circuit layout to reduce signal crosstalk

11. The precision of the external dimensions is ± 0.1mm, which is compatible with the installation slot of the corresponding equipment and has excellent assembly compatibility

12. The welding process is compatible with conventional SMT and THT assembly methods, with strong pad adhesion and high welding reliability

13. Before assembly, a visual inspection is required to confirm defects such as scratches on the wireless path, oxidation of solder pads, and damage to the substrate

14. Storage and transportation should be moisture-proof, anti-static, avoid contact with sharp objects, and prevent damage to the circuit

15. After undergoing full process testing for electrical connectivity, insulation resistance, etc. upon leaving the factory, all indicators meet the industrial PCB quality standards

0190-06279 Product imag

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0190-06279 ontroller Module

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