NMF01 Printed Circuit Board

NMF01 Printed Circuit Board  

Product Details Introduction

NMF01 Printed Circuit Board

-Using FR-4 high-performance substrate (Tg ≥ 130 ℃), it has excellent mechanical strength and heat stability.

-Supports 6-layer high-density wiring design, with a minimum line width/spacing of 3mil/3mil, significantly increasing wiring density.

-The surface is covered with a 1-3 μ m nano protective coating, achieving IPX7 waterproof rating and resisting water vapor and salt spray erosion.

-Adopting the immersion gold surface treatment process to enhance the oxidation resistance of solder joints and improve the stability and lifespan of electrical connections.

-Built in independent grounding and power layers effectively reduce signal interference, with impedance control accuracy of ± 10%.

-The temperature resistance range covers -40 ℃ to+125 ℃, and can be adapted to extreme temperature field scenarios such as industrial and automotive electronics.

-Metalized copper with a thickness of ≥ 20 μ m has excellent interlayer conductivity, strong current carrying capacity, and high stability.

-Through UL94 V-0 flame retardant certification, combined with environmentally friendly VOC free coating, it meets ROSH and industrial environmental standards.

-Support local thick copper process (copper thickness up to 4oz), optimize heat dissipation design, and adapt to high-power component layout.

-Through AOI optical inspection and flying needle testing, the entire quality inspection process ensures that there are no hidden faults such as short circuits or open circuits.

-The coating has high flexibility and easy repairability, and can be peeled off and recoated during maintenance, reducing after-sales costs.

-Suitable for various coating processes such as immersion coating and spray coating, with high mass production efficiency and coating density up to level 8.

-Dielectric strength ≥ 15kV/mm, insulation resistance up to 1 × 10 ¹⁵Ω· cm, excellent electrical insulation performance.

-Adopting a symmetrical compression structure design effectively avoids warping and deformation, ensuring installation accuracy and dimensional stability.

-Widely adaptable to industrial controllers, sensors, and other devices, compatible with various types of component soldering and assembly requirements.

NMF01 Product imag

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