810-046015-010 Printed Circuit Board
Product Details Introduction
-Made with FR4 substrate, Tg value ≥ 135 ℃, excellent heat resistance and mechanical stability
-Complies with IPC-A-600G Class 2 standard and meets industrial manufacturing specifications
-Support RoHS environmental standards, green lead-free design, and adapt to environmental production needs
-Minimum line width/spacing of 0.1mm (4mil), high wiring density, suitable for precision layout
-Finished board thickness of 0.5-3.2mm is optional, with a thickness error of ± 10% and high dimensional accuracy
-Lead free tin spray surface treatment, excellent soldering performance, strong oxidation resistance
-The maximum board size is 265 × 430mm, suitable for installation in various industrial equipment
-Minimum finished aperture of 0.2mm, supports precision drilling, suitable for small components
-Excellent dimensional stability, low deformation rate under high temperature environment
-Support BGA and blind buried hole technology, suitable for complex circuit integration
-Insulation resistance ≥ 800M Ω, strong voltage resistance, stable electrical performance
-Green solder mask+white silk screen, clear identification, easy to maintain and repair
-After flying needle testing and full inspection, there are no quality issues such as open circuit or short circuit
-Working temperature -25~+85 ℃, suitable for harsh industrial environments
-Compatible with multiple design file formats and compatible with mainstream PCB design processes
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