Yaskawa XU-RC350S-J01 Wafer Robot

Yaskawa XU-RC350S-J01 Wafer Robot 

 Introduction

#Yaskawa XU-RC350S-J01 Wafer Robot Product Features

Yaskawa XU-RC350S-J01 is a semiconductor vacuum dual arm wafer manipulator used for internal transfer of 300mm wafer vacuum cavities. Its features are as follows:

1. Dual arm independent telescopic structure, alternately picking and placing wafers to improve transmission throughput

2. Magnetic fluid sealed shaft structure, suitable for high vacuum chamber conditions, low air release

3. Carbon fiber arm fork, lightweight, reduces vibration output during high-speed movement

4. Servo S-curve motion control, smooth start stop, reduces the risk of wafer fragments

5. Micron level repetitive positioning accuracy, meeting the alignment requirements of 12 inch wafers

6. The whole machine adopts low exhaust clean materials to control the generation of particles inside the cavity

7. Built in wafer detection sensor to identify abnormal states such as missing chips and offset

8. Collision detection function, quick shutdown in case of contact to protect the wafer and arm body

9. Multi axis collaborative motion, synchronous execution of rotation, extension, and Z-axis lifting

10. ESD electrostatic protection design to avoid static electricity damage to wafer devices

11. Support SEMI standard FOUP and adapt to mainstream semiconductor carriers

12. External bus communication, docking with device hosts to achieve fully automated processes

13. Onboard operation fault records for easy on-site troubleshooting and review

14. Compact and compact body, suitable for limited installation space inside the cavity

15. Modular component layout, on-site disassembly and maintenance, reducing downtime

Yaskawa XU-RC350S-J01 wafer manipulator, vacuum clean, high throughput, suitable for semiconductor vacuum process wafer handling such as etching and deposition.

Product imag

ontroller Module

Honeywell SC-UCMX01 51307195-175 module
IDPG 940128102 Control card
 OCAH 940181103 logic card

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