AMAT Applied Materials 0190-24680 Panel Temperature Controller

AMAT Applied Materials 0190-24680 Panel Temperature Controller

Product Details Introduction

1、 Product Overview

AMAT Applied Materials 0190-24680 is a panel temperature controller primarily used for precise temperature control of heating chambers, process chambers, gas panels, and other thermal control areas in semiconductor equipment.

This controller is usually installed in the device control panel or subsystem module, and temperature is collected through thermocouples (TC) or RTDs (resistance temperature sensors), and the heating power output is adjusted through PID control algorithm.

In AMAT's CVD, PVD, Etch, CMP and other equipment platforms, 0190-24680 is one of the important components to maintain process stability, ensuring that material deposition, etching or reaction processes are carried out under optimal temperature conditions.

2、 Technical parameters

Product type: Digital Temperature Controller

Input type: K-type, J-type thermocouple or PT100/RTD signal input

Output mode: Relay output/SSR (Solid State Relay) drive/Analog voltage output (depending on device configuration)

Display mode: LED digital display (set value SV and actual value PV are displayed simultaneously)

Control accuracy: ± 0.1% F.S. (typical)

Adjustment method: PID automatic adjustment (with self-tuning function)

Power specifications: 24 VDC or 100-240 VAC (depending on device version)

Installation form: panel embedded (standard 1/8 DIN or 1/4 DIN size)

Working temperature range: 0-50 ℃ (controller environment)

Main interfaces: front panel setting keys, display screen; Rear signal input/output terminal

3、 Product application areas

Application field specific purpose and functional description

Semiconductor manufacturing equipment is used to control the temperature of process chambers, gas pipelines, substrate stages, or heating plates, ensuring thermal uniformity and stability during deposition or etching processes.

The chemical vapor deposition (CVD) system adjusts the reaction chamber temperature to control the film growth rate, composition uniformity, and stress characteristics.

The Physical Vapor Deposition (PVD) system controls the temperature of the sputtering source, substrate heating stage, or baffle heater to ensure the adhesion and crystallization quality of the metal or dielectric film.

The Etch System manages the chamber wall temperature and electrode temperature to maintain gas chemical reaction equilibrium and stable ion energy distribution.

Chemical mechanical polishing (CMP) equipment controls the heating of the slurry or the temperature of the worktable to avoid temperature fluctuations that affect the polishing rate and surface smoothness.

The Gas Panel regulates the temperature of the gas heating zone to prevent condensation of high viscosity gases and maintain gas flow rate and chemical activity.

AMAT Applied Materials  0190-24680 Product imag

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