AMAT Applied Materials 0190-26327 Thermal Ion Heater

AMAT Applied Materials 0190-26327 Thermal Ion Heater

Product Details Introduction

AMAT Applied Materials 0190-26327 Thermal Ion Heater

Product Overview

0190-26327 is a thermal ion heater component used in AMAT semiconductor equipment. It mainly serves as a high-temperature heating unit, utilizing the thermal ion emission effect or efficient electric heating structure to provide a uniform and stable heat source for process chambers or specific components. This component is commonly used in thin film deposition, surface treatment, and wafer heating processes, and is an important hardware to ensure precise and controllable process temperature.

Technical functions and features

High temperature heating capacity

Can provide a stable and controllable high-temperature environment for activating reactive gases or accelerating surface reactions.

Support rapid heating and cooling to meet the dynamic temperature control requirements of semiconductor processes.

thermionic effect

Utilize the electron emission characteristics of heating elements at high temperatures to enhance the surface activation effect.

In certain processes, it can be used to assist in plasma generation or improve reaction efficiency.

uniform heating

By optimizing the structural design, temperature uniformity in local areas can be achieved to avoid uneven heating of the wafer.

Integrated protection design

Cooperate with temperature sensors and interlocking systems to prevent overheating and damage.

Equipped with redundant safety mechanisms to ensure automatic power cut-off in case of abnormal conditions.

Application field

CVD (Chemical Vapor Deposition) equipment

Used for preheating gases, promoting the decomposition of reactants, and improving the quality of thin film deposition.

Assist in the deposition of high-quality oxide, nitride, and metal thin films.

PVD (Physical Vapor Deposition) equipment

Provide thermal activation conditions for the target material or process area during the sputtering coating process.

Used to improve the crystallinity and density of thin films.

etching process

By stimulating surface reactions through heating, the etching rate or uniformity can be improved.

Wafer pretreatment and cleaning

Preheat the wafer before entering the reaction chamber to remove moisture or organic residues.

Cooperate with plasma cleaning process to improve surface cleanliness.

AMAT Applied Materials 0190-26327 Thermal Ion Heater Product imag

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