MKS AX7670-19 Remote Plasma Source

MKS AX7670-19 Remote Plasma Source 

 Introduction

The MKS AX7670-19 remote plasma source is a downstream plasma unit specifically designed for semiconductor chamber cleaning, generating active free radicals for chamber decontamination. The core product features are as follows:

1. Circular plasma chamber with high gas dissociation efficiency

2. Output neutral free radicals to reduce wafer charge damage

3. Compatible with various cleaning process gases such as NF3 and O2

4. No need for argon assisted ignition, simplifying the process formula

5. Wide pressure flow range, wide process adaptation range

6. Rapid plasma ignition reduces the cleaning time of the chamber

7. Built in real-time monitoring of power and temperature status

8. Multiple protections for overheating, overcurrent, and arc faults

9. Support device bus communication and interface with the machine master control

10. Fault code output for quick identification of anomalies

11. The installation structure of the top cover requires minimal space for equipment integration

12. Quartz cavity material, resistant to active gas corrosion

13. Support long-term continuous work and adapt to mass production lines

14. Modular components, easy on-site replacement and maintenance

15. Uniform output of free radicals and consistent cavity cleaning effect

The MKS AX7670-19 remote plasma source has reliable performance and is commonly used in dry cleaning processes for CVD and etching equipment chambers.

Product imag

ontroller Module

PFSK152 3BSE018877R1 pulse output card
PP877K 3BSE069274R1 Touch screen
PPC907BE 3BHE024577R0101 processor input module

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