AMAT Applied Materials 5000-158 Controller

AMAT Applied Materials 5000-158 Controller

Product Details Introduction

AMAT Applied Materials 5000-158 Controller

Product Overview

5000-158 is a controller module in AMAT semiconductor process equipment, mainly used for monitoring and managing key subsystems in the process. As one of the core electronic control units of the device, it undertakes the functions of signal acquisition, logical operation, and instruction execution, ensuring stable processes such as deposition, etching, and cleaning.

Technical functions and features

System monitoring and logical operations

Collect data from subsystems such as gas panels, vacuum systems, temperature sensors, and RF power supplies.

Execute logical operations and process control algorithms, and issue control instructions to executing components.

Multi channel control capability

Can manage multiple gas paths, heaters, vacuum valves, or power modules simultaneously.

Support the switching and operation of complex process formulas.

Interlocking and Security Protection

Built in interlock logic, when detecting abnormalities such as the chamber door not being closed, insufficient vacuum, high temperature, etc., the relevant actions will be immediately stopped.

Provide hardware level fast protection response and reduce process risks.

Communication and Interface

Communicate with the upper control computer or PLC system to upload process status data.

Provide standardized interfaces that are compatible with other AMAT control cards and I/O boards.

modular design

Designed as replaceable modules for quick on-site maintenance and replacement.

Support device upgrades and feature extensions.

Application field

CVD (Chemical Vapor Deposition) equipment

Control gas flow rate, heating system, and reaction chamber conditions to ensure stable deposition process.

PVD (Physical Vapor Deposition) equipment

Manage sputtering power supply, gas input, and vacuum system to ensure coating consistency.

Etching equipment

Perform gas mixing, RF power regulation, and process interlock protection to ensure etching accuracy.

Cleaning and surface treatment equipment

Control the plasma source, gas ratio, and temperature to accelerate cleaning efficiency.

Wafer Transfer and Load Lock

Manage the operation of transfer robotic arms, vacuum pumps, and hatch doors to ensure safe wafer handling.

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