AMAT Applied Materials 0500-01065 Interface Module

AMAT Applied Materials 0500-01065 Interface Module

Product Details Introduction

AMAT Applied Materials 0500-01065 Interface Module

Product application areas

1、 Semiconductor Manufacturing Equipment Platform

Mainly used in the AMAT Centura series 300 mm process platform.

The Loadlock interface interlock module belonging to multi chamber equipment is responsible for the safe transition between atmospheric and vacuum chambers.

2、 Core application scenarios

Wafer transfer process

Control and monitor the switch status of the Loadlock cabin door.

When the wafer is transferred into or out of the chamber by the handling robot, ensure that the operation is only allowed when the door is completely closed and the vacuum state meets the requirements.

Vacuum and atmospheric isolation

Monitor the pressure difference between the internal Loadlock and the process chamber to ensure that the pressure reaches a safe range before allowing the valve to be opened.

Provide interlocking logic with vacuum pumps and valves to avoid vacuum failure caused by misoperation.

Security interlock logic

When the door is not locked, the pressure is unbalanced, or the sensor is abnormal, prevent direct communication between the chamber and the outside or other chambers.

Provide protection logic to prevent wafer contamination or equipment damage.

Signal interface function

As an I/O interface board between Loadlock and the main controller (PLC/system control computer), it transmits door lock status, sensor feedback, and execution signals.

Responsible for collecting and converting interface signals to ensure timely response of the control system.

3、 Typical application areas

CVD (Chemical Vapor Deposition) equipment: used for wafer loading, unloading, and transition before and after thin film deposition processes.

PVD (Physical Vapor Deposition) equipment: used as an intermediate transition module between atmospheric and vacuum chambers in sputtering coating equipment.

Etching equipment: Ensure that the wafer is safely isolated before being transferred to the high vacuum etching chamber.

Cleaning/surface treatment equipment: Ensure that the loading process does not affect the vacuum process environment in processes that require frequent entry and exit of wafers.

AMAT Applied Materials 0500-01065 Interface Module Product imag

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