Home > Product > Servo control system > Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot

  • Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot
  • Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot
  • Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot
Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot

Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot

Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot 

 Introduction

The Hirata AR-W170VCL-4-T-40 four axis dual arm robot is a vacuum wafer handling manipulator used by Hirata Machinery. It is used in the vacuum chamber of semiconductor equipment, and its arms alternate to pick up and deliver wafers, directly determining the throughput capacity of the machine.

Product Features

1. Four axis linkage dual arm structure, with one arm picking and the other arm releasing chips alternately, effectively reducing wafer exchange time and improving overall production capacity

2. Direct drive motor paired with steel belt drive, with minimal vibration during operation and low risk of scratching the wafer during high-speed movement. Good particle control is also achieved

3. Built in collision detection, it will immediately stop when encountering foreign objects, providing maximum protection for the silicon wafer and arm, reducing significant losses on site

4. Vacuum specific sealing structure, low gas release material, suitable for high vacuum chambers, will not pollute the process environment

5. Absolute value encoder design, no need to worry about losing the origin when power is off, on-site debugging and spare parts replacement are more convenient

Product Specifications

1. Suitable for 300mm wafer handling and working in a vacuum environment

2. Four axis servo drive, micrometer level repetitive positioning accuracy

3. Support device bus communication and linkage scheduling with the main control of the entire machine

4. Vacuum working condition inside the cavity, able to withstand the internal environment of semiconductor equipment

5. Vacuum flange integrated installation, directly assembled into the process equipment chamber

Application Areas

1. Etching and thin film deposition equipment, vacuum chamber wafer transfer

2. Internal handling unit of load lock for clustered semiconductor equipment

3. Wafer transfer operation between vacuum process chambers

4. Internal robotic arm unit of 300mm wafer processing equipment

5. Replacement of spare parts for faulty robots on old production line machines

The Hirata AR-W170VCL-4-T-40 four axis dual arm robot belongs to the core handling component of the vacuum end. Once there is shaking or positioning deviation, it is easy to cause wafer dropping and fragmentation, directly resulting in wafer scrap.

Product imag

AR-W170VCL-4-T-40.webp.jpg

ontroller Module

DSQC639 3HAC025097-00116 Teaching module
VMIPCI-5565-110000 Steam gas turbine module
3BHE022294R0101 controller module

Other website links

086318-002 电路板模块
Bently 3500/44M-01-00 176449-03 振动监测器
YOKOGAWA NFJT100-S10E 自动化控制器 

T23NRLH-LNF-NS-00CACR-SR30BZ1SD46413701
T23NRHK-LNF-NS-00CACR-UP130AABY18,3HAB-8572-106
T23NRHJ-LNN-NS-00CACR-PR01AE4ESY6061-01666
T23NRHJ-LNF-NS-00CACR-IR30SEB23158-100
T22NSLS-LDN-SS-02CACR-SR15BY1SSY48E067-11384-0000
T22NRLH-LNN-NS-00CACR-JU033D2A060-00867-0002


PREVIOUS:Coherent 4S091-147-2 laser module NEXT:Period

Obtain the latest price of Hirata AR-W170VCL-4-T-40 Four Axis Dual Arm Robot