Ebara E100-R23JRS Pure Water Transfer Spray Pump Module

Ebara E100-R23JRS Pure Water Transfer Spray Pump Module 

 Introduction

Ebara E100-R23JRS Pure Water Transfer Spray Pump Module, Ebara Semiconductor Ultra Pure Water Transfer Unit, supplies process pure water to the machine. The stability of water pressure and flow directly affects the wafer cleaning effect.

Product Features

1. The liquid receiving components are corrosion-resistant, have low precipitation, and will not pollute the ultrapure water quality, meeting the requirements for semiconductor water use

2. Jet structure, good self-priming ability, less prone to gas blockage and interruption, ensuring water supply continuity

3. Built in pressure and flow monitoring, abnormal states can output alarms, making it convenient for engineers to detect hidden dangers in advance

4. Low vibration during operation, reducing pipeline shaking and lowering the risk of particle detachment in the pipeline

5. Modular integrated assembly, standardized pipeline interface, easy on-site disassembly and maintenance

Product Specifications

1. Suitable for semiconductor ultrapure water medium transportation

2. Equipped with pressure detection feedback and connected to equipment control system

3. Can run continuously for a long time, suitable for 24-hour production on the production line

4. Standard pipeline interface, convenient for connecting to pure water circuit

5. Adapt to the operating environment between workshop equipment and support direct replacement of spare parts

Application Areas

1. Pure water supply for semiconductor equipment wafer cleaning station

2. Machine ultra pure water circulation and conveying system

3. Wet process equipment water supply unit

4. Factory pure water distribution pipeline pressurization module

5. Replacement of spare parts for pump body due to production line malfunction

Once the Ebara E100-R23JRS pure water delivery jet pump module experiences flow attenuation and water quality precipitation, it is easy to cause poor cleaning and result in particle defects on the wafer surface.

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