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  • AMAT 0190-13851 Rotating Combined Sputtering Machine
  • AMAT 0190-13851 Rotating Combined Sputtering Machine
  • AMAT 0190-13851 Rotating Combined Sputtering Machine
AMAT 0190-13851 Rotating Combined Sputtering Machine AMAT 0190-13851 Rotating Combined Sputtering Machine AMAT 0190-13851 Rotating Combined Sputtering Machine

AMAT 0190-13851 Rotating Combined Sputtering Machine

AMAT 0190-13851 Rotating Combined Sputtering Machine 

 Introduction

AMAT 0190-13851 is an application material PVD equipment rotary sputtering assembly used in magnetron sputtering process to achieve metal thin film deposition under wafer rotation conditions. It belongs to the core process component of physical vapor deposition.

Product Features:

1. Original set of sputtering components, directly compatible with AMAT P5000 series PVD machines, with good interchangeability

2. Wafer base rotation mechanism, rotating film formation, improving film thickness uniformity

3. Integrated target material clamping, water cooling, shielding structure, resistant to plasma sputtering corrosion

4. Vacuum sealed structure ensures high vacuum in the chamber and reduces particle contamination

5. Built in position and speed sensors, which can be linked with the main control of the machine, supporting 7 × 24-hour mass production operation

Product Parameters:

1. Model: 0190-13851

2. Component type: Rotating combined sputtering assembly

3. Compatible machine: AMAT P5000 PVD thin film deposition equipment

4. Process mode: Magnetron sputtering thin film deposition

5. Structure: Rotating base+complete set of sputtering cathode components

Application fields:

1. AMAT PVD equipment wafer rotation magnetron sputtering film formation

2. Deposition process of metal and metal nitride thin films

3. Semiconductor interconnect layer, barrier layer, thin film process cavity spare parts

4. Maintenance and replacement of sputtering assembly failure on the machine

5. Spare parts inventory reserve for semiconductor PVD equipment

The 0190-13851 sputtering assembly relies on a rotating substrate structure to improve the uniformity of the film layer, and is a key process group for the preparation of semiconductor metalized thin films

Product imag

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