MKS AX7700MTS-02 plasma source
Introduction
MKS AX7700MTS-02 is a Paragon series remote plasma source, specifically designed for semiconductor process chamber cleaning. It dissociates NF ∝ to generate fluorine radicals and is used for in-situ cleaning of CVD and ALD chambers.
Product Features:
1. High gas dissociation efficiency, sufficient free radical production, fast chamber cleaning speed
2. Specialized PEO plasma block with low particle output, reducing the risk of wafer contamination
3. Compatible with NF ∝, O ₂ mixed process gases and compatible with multiple cleaning formulas
4. Supports EtherCAT and analog dual communication, can be connected to remote monitoring of machines
5. Modular and easily replaceable structure, reducing equipment downtime and maintenance time
Product Parameters:
1. Maximum gas flow rate: 8SLM
2. Work pressure: 1-10 Torr
3. Working gases: NF ∝, O ₂ Ar
4. Communication interface: EtherCAT, analog I/O
5. Cooling method: air-cooled
Application fields:
1. Remote plasma cleaning of semiconductor CVD process chamber
2. Cleaning of ALD thin film equipment chamber for sediment removal
3. Etching equipment chamber maintenance and cleaning unit
4. Cleaning of MEMS device process equipment cavity
5. Replacement of spare parts for semiconductor process equipment
MKS AX7700MTS-02 provides efficient and stable remote plasma cleaning capability for semiconductor process chambers
Product imag

ontroller Module
C&H DR-100-24 Switching power supply module
3BDH000364R0002 PM783FB0 process control module
3BSE042235R1 PP845 Touch screen
Other website links
XVC770BE101 3BHE021083R0101 电路板模块
EMERSON VE4001S2T2B6 I/O接口载体模块
EMERSON VE4005S2B1 模拟量输出输入模块
| 33VM62-000-17 | 3090-SCCT043 | IC3600VDAC1C |
| 33VM62-000-1 | IC3600VDAC1 | |
| 33VM52-020-9 | 3090-SCCT022 | IC3600VCDA1 |
| 33VM52-008-4 | 3090-RTM-317 | IC3600VBEA1 |
| 33VM52-000-4 | 3090-MCI101 | IC3600VBCU1B |
| 33VM52-000-29 | 3090-CAB108 | IC3600VBCU1 |