KLA Tencor 027128-000 Interface Board

KLA Tencor 027128-000 Interface Board

Product Details Introduction

KLA Tencor 027128-000 Interface Board - Product Application Fields

This interface board is a type of signal bridging and data communication module in KLA Tencor's high-end detection and measurement equipment. Although the specific circuit functions are not described in public information, based on the naming conventions and application backgrounds of the models, it can be inferred that they play a key role in the following systems:

Signal interaction and control bridging in wafer inspection system

Applied to KLA's wafer inspection equipment such as Surfscan, P-series, eS series, etc;

Responsible for signal conversion and connection between the main control CPU, image acquisition unit, and driver;

Support stable transmission of analog signals, digital signals, or optoelectronic signals between different modules.

2. Interface of data collection system

In the image processing or laser scanning module, transmit sensor/detector data to the control system;

Plays a role in data buffering, interface matching (such as RS-422, LVDS, TTL), etc.

3. Control bus or device submodule connection

Used to connect the main controller with subsystems such as motion control, power module, sensor module, etc;

Support multiple industrial standard interfaces (such as CAN, I ² C, SPI, PCI, PXI, etc.);

It may serve as a bridge board to connect the motherboard and peripherals.

4. Testing and Debugging Interface Module

Provide testing interfaces for system status, such as diagnostic signals, signal loopback, error detection, etc;

Used for equipment factory debugging, routine maintenance, or fault location.

Applicable industries and system scenarios

Application direction scenario description

Semiconductor testing equipment includes wafer defect detection, CD measurement, and overlay alignment measurement

Electrical connections between the control system of the automation platform system and the moving parts and image modules

Optical/laser scanning system image transmission, optical adjustment signal synchronization, power and ground isolation

Data integration and conversion bridging between multiple signal sources in the data communication module

Product imag

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