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  • KLA Tencor 710-658232-20 Memory Controller
  • KLA Tencor 710-658232-20 Memory Controller
KLA Tencor 710-658232-20 Memory Controller KLA Tencor 710-658232-20 Memory Controller

KLA Tencor 710-658232-20 Memory Controller

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KLA Tencor 710-658232-20 Memory Controller

Product Details Introduction

KLA Tencor 710-658232-20 Memory Controller

Product Overview:

This memory controller is an important core module used for data management and processing in KLA Tencor wafer inspection systems (such as the 2132 series). It is responsible for coordinating data flow, cache operations, and memory access control between various processor units in the system, and is an important component to ensure efficient operation of the entire machine.


Core functions

Memory Management and Optimization

Control the data access between various data caches, DDR memory, or embedded RAM modules in the system to improve memory bandwidth utilization and reduce data access conflicts.


Data flow coordination

Implement data exchange scheduling between image acquisition cards, image processing units, and storage controllers to ensure the accuracy and timing matching of high-speed data transmission.


Instruction scheduling and buffer control

In real-time image analysis and high-speed control, logical mechanisms such as interrupt response, read/write priority, and FIFO management are provided to ensure the stability of data processing.


System bus interface support

Compatible with motherboard bus and PCI/PCIe subsystem, communicates with other modules through specific bus protocols, and supports high bandwidth data communication links.


Technical Characteristics

Multi layer high-density PCB design with strong signal integrity and electromagnetic compatibility performance.


Industrial grade components are selected to operate stably in environments with high loads and clean room requirements for a long time.


Onboard cache system with local cache and high-speed cache control logic to improve data processing efficiency.


Redundancy protection mechanism, supporting error detection and correction (ECC) or hardware watchdog function to enhance fault tolerance.


Typical application scenarios

Wafer defect detection equipment: coordinates a large amount of high-speed data streams between image acquisition and image processing units.


Image analysis system: Provides cache scheduling and memory control services for high-speed image processing chips.


Semiconductor automatic detection platform: integrated into the main control framework of the system, serving as a key control node for the data channel.

Product imag

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PMB33E-20100-01IIMCP0257160001-GF DSDP 150
PMB33E-20100-00ECS 086329-00457120001-PX DSTA 001
PMB33E-10216-03NKTT01M21NSXA-LNN-NS-02
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PMB33E-10216-0007ET83AP21NRXB-LSS-NS-05
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