Daihen TW39-000021-11 RF Automatic Matcher

Daihen TW39-000021-11 RF Automatic Matcher 

 Introduction

Daihen TW39-000021-11 is a semiconductor process RF automatic matching device that adjusts impedance in real-time, reduces reflected power, and ensures stable power transmission in the plasma chamber.

Application areas

1. Impedance matching control of semiconductor dielectric etching equipment

2. RF impedance adjustment of PECVD thin film deposition chamber

3. Power matching for remote plasma source chamber cleaning

4. Adaptation of plasma load in dry etching wafer process

5. Chip ashing and debonding process RF circuit tuning

6. RF matching of atomic layer deposition ALD equipment

7. Compound semiconductor plasma process system

8. Dynamic adaptation of RF load for PVD coating machine

9. Plasma treatment of semiconductor load lock cavity

10. RF power supply supporting unit for semiconductor process equipment

Product Parameters

1. Suitable for 13.56MHz RF frequency band, wide impedance automatic tuning range

2. Fast matching response, quickly reducing reflected power after process switching

3. Water cooling and heat dissipation structure, supporting continuous operation of 7 × 24-hour production line

4. Equipped with analog and digital communication interfaces to interface with the main control system of the equipment

5. Built in over power, over temperature, and standing wave ratio over limit protection alarms

In summary, Daihen TW39-000021-11 has fast matching and tuning speed, and is resistant to process impedance fluctuations, making it a key impedance matching component for semiconductor plasma process RF links

Product imag

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