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  • TEL Tokyo Electron 3D81-000102-V1 Interface Board
  • TEL Tokyo Electron 3D81-000102-V1 Interface Board
  • TEL Tokyo Electron 3D81-000102-V1 Interface Board
TEL Tokyo Electron 3D81-000102-V1 Interface Board TEL Tokyo Electron 3D81-000102-V1 Interface Board TEL Tokyo Electron 3D81-000102-V1 Interface Board

TEL Tokyo Electron 3D81-000102-V1 Interface Board

  • Goods status: new/used
  • Delivery date: stock
  • The quality assurance period: 365 days
  • Phone/WhatsApp/WeChat:+86 15270269218
  • Email:stodcdcs@gmail.com
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TEL Tokyo Electron 3D81-000102-V1 Interface Board

Product Details Introduction

1、 Product functional positioning

The 3D81-000102-V1 interface board is an important component used for signal conversion, control communication, and module interconnection in Tokyo Electron semiconductor manufacturing equipment. It serves as a data bridge between the device control system and external execution units, playing a role as a "control center extension" during the operation of the device.


2、 Main application areas

1. Communication interface between device modules

Function description: Connect the main control system (such as the main controller, processor module) with subsystems (such as gas control unit, temperature control module, motor controller);


Application value: Ensure signal integrity and synchronous operation between various functional modules, improve system response speed and overall collaboration capability;


Typical equipment: used in TEL etching machines, CVD equipment, developing systems, etc.


2. I/O signal input/output distribution and management

Function description: Responsible for collecting input signals from sensors, actuators (such as solenoid valves, servo motors, etc.), and outputting control signals;


Interface types: may include digital signals (DI/DO), analog signals (AI/AO), communication ports (such as RS-232, RS-485, CAN, Ethernet, etc.);


Application scenarios: temperature control, airflow regulation, pressure detection, motor drive signal interaction, etc.


3. Multi system collaborative control bridge unit

Collaboration: Support data interconnection among multiple subsystems to achieve synchronous control of overall device operation;


Bus support: may embed support for standard industrial communication protocols such as I ² C, SPI, MODBUS, SECS/GEM, etc;


Process assurance: Ensure the coordinated operation of various subsystems during wafer processing to avoid delays or interference.

Product imag

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