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  • KLA Tencor 710-651836-20 preamplifier module
  • KLA Tencor 710-651836-20 preamplifier module
KLA Tencor 710-651836-20 preamplifier module KLA Tencor 710-651836-20 preamplifier module

KLA Tencor 710-651836-20 preamplifier module

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  • Delivery date: stock
  • The quality assurance period: 365 days
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  • Email:stodcdcs@gmail.com
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KLA Tencor 710-651836-20 preamplifier module

Product Details Introduction

The KLA Tencor 710-651836-20 Preamplifier Module is a high-sensitivity signal amplification unit designed specifically for the optical detection and measurement system of KLA Tencor. It is mainly used for primary amplification and conditioning of weak analog signals, so that subsequent processing modules can accurately collect and analyze data. It plays a crucial role in semiconductor wafer defect detection, imaging systems, or laser measurement systems.


1、 Product Overview

Product model: 710-651836-20


Type: Preamplifier Module


Manufacturer: KLA Tencor


Function positioning: Used for high gain and low noise amplification of low-level analog signals


Adaptation platform: KLA Tencor 710 series detection and measurement equipment


2、 Core functions

Function module description

Low noise amplification performs primary amplification on weak signals from photodetectors, sensors, or probes to improve signal-to-noise ratio (SNR)

Signal conditioning includes filtering, bias adjustment, bandwidth control, and other functions to adapt the output signal to the backend sampling or digitization module

High frequency response supports the demand for high-speed sampling equipment, suitable for dynamic measurement and high-speed imaging systems

Electromagnetic shielding and stability have good EMI shielding design, ensuring stable and reliable operation in complex industrial environments


3、 Application Fields

1. Wafer surface defect detection system

Connect CCD, CMOS, APD (avalanche photodiode) and other detectors for front-end processing of weak photoelectric signals.


Enhance image contrast and improve defect resolution during the scanning process.


2. Optical measurement system

Receive interferometers, laser reflection signals, and perform pre amplification to measure physical parameters such as wafer surface morphology and film thickness.


Can be combined with Z-axis feedback system to achieve dynamic focusing and tracking.


3. e-beam electron beam imaging system

Amplify secondary electronic signals or current signals with high bandwidth to achieve clear image acquisition.


This is particularly important under low-dose imaging conditions, as it helps maintain high sensitivity.


4. Automatic alignment system

Amplify weak alignment signals (such as laser alignment or stripe interference signals) and output them to the controller to improve system alignment accuracy.

Product imag

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