CTI Kryogenics 8185154G001 Wafer Chuck Cooling System

CTI Kryogenics 8185154G001 Wafer Chuck Cooling System

 Introduction

CTI Kryogenics 8185154G001 Wafer Chuck Cooling System

Product Features

1. High temperature control accuracy, maintaining uniform and stable wafer temperature

2. Strong low-temperature cooling capacity, suitable for plasma process heat dissipation

3 closed circulation pipelines, clean and free of particle pollution

4. Equipped with temperature monitoring and automatic alarm protection for overheating

5 modular design, easy disassembly and replacement

Product Specifications

1. Compatible with semiconductor machine standard power supply

2 closed-loop refrigerant circulation, wide temperature range

3 built-in temperature sensors for real-time data collection

4. Support communication docking with the main control system of the cavity

5 Vacuum chamber adapted sealing structure

Application Areas

Semiconductor etching machine wafer chuck cooling

2 PVD thin film deposition electrostatic chuck temperature control

3 Plasma Process Chamber Wafer Cooling

Temperature control of semiconductor thin film process

5. Maintenance and replacement of CTI low-temperature cooling spare parts

This CTI Kryogenics 8185154G001 cooling system is used for constant temperature control of wafer chucks and is a commonly used low-temperature spare part in semiconductor vacuum processes

Product imag

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073-404555-00	03-10639-00	19-00130-00
073-404423-00	02-00152-00	03-056746-00
073-404337-00	193X802AAG01	6DD1684-0FD0
073-404227-00	6DD1684-0DB2	6DD1684-0GH0
073-404145-00	531X304IBDASG1	6SC6100-0AB80
0644536-000	531X304IBDARG1	6DD1684-0GF0