Lam 853-23245-002 Heat Exchange Base Assembly

Lam 853-23245-002 Heat Exchange Base Assembly 

 Introduction

Assembly of Lam 853-23245-002 heat exchange base, equipped with internal electrostatic suction cups and cooling base components for etching machine chamber.

Product Features:

1. Uniform thermal contact ensures stable temperature control of the wafer and small temperature difference inside the wafer

2. Corrosion resistant chamber compatible material, resistant to etching process gas erosion

3. Integrated cooling channel and sealing structure, in-situ disassembly and replacement as a whole

4. Reliable pressure sealing reduces the risk of water and gas leakage

5. Suitable for continuous production on the production line, with minimal deformation during long-term operation

Product Parameters:

1. Matching etching equipment cavity installation positioning interface

2. Built in cooling water circuit for rapid heat transfer

3. Adapt equipment process temperature range to meet temperature control requirements

4. Integrated sealing components ensure the sealing performance of waterways and chambers

5. Can cooperate with machine temperature sensing to complete temperature feedback

Application fields:

1. Lam etching equipment ESC electrostatic suction cup cooling support base

2. Plasma etching chamber wafer workstation heat exchange operation

3. Supporting temperature control for semiconductor etching process wafers

4. Replacement of spare parts for the aging and damaged base of the Panlin etching equipment

5. After maintenance and upkeep of the cavity, assemble and debug the entire base

Lam 853-23245-002 directly determines the heat dissipation effect of the wafer and plays a key role in the uniformity and yield of the etching process.

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