TEL 3887-236819 Wafer Conveyor Robot

TEL 3887-236819 Wafer Conveyor Robot 

 Introduction

TEL 3887-236819 wafer transfer robot, an internal vacuum end wafer transfer mechanical module of Tokyo Electronic Etching and Deposition Equipment.

Product Features:

1. Vacuum adaptive structure, low exhaust material, will not pollute the process environment inside the chamber

2. Soft motion trajectory, gentle acceleration and deceleration, reducing the risk of thin wafer warping and cracking

3. Built in collision sensing, immediately stops when encountering foreign objects, protecting the wafer and chamber components

4. Integrated modular assembly, complete disassembly and assembly, no need to disassemble internal transmission parts

5. Good durability performance in vacuum environment, suitable for high-frequency cyclic handling operations on production lines

Product Parameters:

1. Match TEL equipment vacuum chamber installation position with communication signal

2. High repeatability positioning ensures the accuracy of wafer workstation handover and alignment

3. Adapt to the temperature conditions of the vacuum process inside the cavity

4. Receive machine motion commands and provide feedback on wafer positioning status

5. Fault output status code for easy maintenance and quick troubleshooting

Application fields:

1. TEL etching machine vacuum chamber internal wafer cross station transfer

2. Semiconductor thin film equipment vacuum end wafer pick-up and transfer

3. Material flow between wafer stations inside the process chamber

4. Replacement of faulty spare parts for Tokyo Electronic Technology Machine's robotic arm

5. Calibration and debugging of transportation trajectory after cavity maintenance is completed

The motion control level of TEL 3887-236819 directly determines the reliability of wafer handover in the vacuum chamber, affecting equipment capacity and fragment rate

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