MKS 626B11TDE pressure sensor

MKS 626B11TDE pressure sensor

 Introduction

MKS 626B11TDE pressure sensor

1. High measurement accuracy and small error in vacuum pressure numerical detection

2. Tolerate clean process conditions and adapt to semiconductor dust-free environments

3. Stable signal output, no significant drift in long-term monitoring data

4. The internal structure is corrosion-resistant and can come into contact with mild process specialty gases

5. Excellent temperature adaptability, stable measurement under temperature fluctuations in the chamber

6. Fast response speed, able to quickly capture changes in chamber pressure

7. Resistant to external electromagnetic interference, the operation of surrounding high-power equipment is not affected

8. Standardized installation structure, easy and convenient disassembly and replacement of the machine

9. Built in basic protection, slight pressure impact will not damage core components

10. Low zero drift, no need for frequent calibration and debugging

11. Excellent sealing performance, less likely to cause air leakage when connected to the vacuum chamber

12. Compact in size, the small device cavity can also be arranged and installed inside

13. Low operating power consumption, low load for long-term continuous monitoring

14. After rigorous calibration at the factory, it can be put into normal use immediately upon installation

15. Long service life, strong durability for all-weather operation of semiconductor production lines

MKS 626B11TDE is mainly used for high-precision real-time monitoring of vacuum pressure inside semiconductor coating and etching equipment chambers.

Product imag

ontroller Module

AD908AC Output structure module
AD908AE structure cable
AD908CC Communication cable

Other website links

MOTOROLA MVME761-001 嵌入式控制器模块
MOTOROLA 188987-008R 188987-008R001 自动化控制模块
EMERSON PR6426010-140+CON021916-200 前置传感器