PFU LIMITED PA25135-B04208 heat dissipation board

PFU LIMITED PA25135-B04208 heat dissipation board

 Introduction

PFU LIMITED PA25135-B04208 heat dissipation board

1. PA25135-B04208 is made of high thermal conductivity metal material, which has excellent heat conduction efficiency

2. The contact surface is processed smoothly to ensure a tight fit with the heating element and reduce thermal resistance

3. Optimize the heat dissipation structure design, expand the effective heat dissipation area, and quickly dissipate accumulated heat

4. Surface anti-corrosion treatment, PA25135-B04208 can withstand changes in temperature and humidity inside the equipment

5. Rigid structure is stable and not prone to deformation and warping during long-term operation

6. Accurately reserve positioning holes for direct matching and assembly with original equipment

7. Adapt to thermal pads and thermal grease to build a complete heat dissipation path

8. The weight ratio is reasonable, and it will not cause additional stress on the PCB board after installation

9. PA25135-B04208 undergoes flatness and thermal conductivity sampling inspection before leaving the factory

10. Compact exterior design, saving limited installation space inside the equipment

11. Resistant to high and low temperature cycles, with continuous operation and heat dissipation performance that is not easily degraded

12. The edge craftsmanship is neat, and the assembly process avoids scratching the surrounding components

13. Suppress the temperature rise of power devices, delay circuit aging, and improve stability

14. Standardized appearance specifications, convenient and efficient replacement and disassembly of spare parts

15. Complies with the original equipment thermal management design specifications

PFU LIMITED PA25135-B04208 heat dissipation board is used for thermal conduction and heat dissipation components of power components in industrial control equipment

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