Daihen SVD-121-X1784 Wafer Alignment Instrument
Introduction
Product Features of Daihen SVD-121-X1784 Wafer Alignment Instrument
Daihara DAIHEN factory matching, compatible with 300mm semiconductor etching and deposition equipment wafer transfer cavity
High precision optical scanning sensing, non-contact recognition of wafer edges and notch markings
Micro level positioning level, center deviation control ≤ 0.08mm, angle error ± 0.02 °
High speed alignment calculation program, short single wafer calibration time, improves the overall production cycle of the machine
Vacuum adsorption bearing platform, suitable for silicon wafers and quartz wafers, without back scratches or contamination
The servo rotation module runs smoothly, suppresses shaking, and is compatible with ultra-thin and fragile wafers
Class1 clean machine design, low gas release and low dust emission material, matched with dust-free workshop standards
Real time monitoring of multiple vacuum pressures, automatic alarm for vacuum leaks, to prevent wafer dropping
All metal shielding shell, isolating cavity RF electromagnetic interference, stable sensing signal without drift
Split modular structure, can be disassembled and repaired separately, greatly reducing the downtime of the machine
Simultaneously supporting both gap and flat edge wafer benchmark recognition, suitable for multi specification process wafers
Standardized equipment bus communication, real-time transmission of alignment deviation data to the main control
Sealed low dust bearing components, supporting 7 × 24-hour uninterrupted clean workshop operation
Multiple sets of fault status indicator lights, quickly distinguish between vacuum, sensing, and motor abnormal faults
Small and compact body structure, suitable for devices with narrow transmission chambers and built-in installation space
The Daihen SVD-121-X1784 wafer alignment device is a core positioning unit for 300mm wafer transfer, with high alignment accuracy and excellent cleanliness performance, ensuring stable handling and process.
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