DALSA OC-80-04K25-03 Scanning Camera Component
Introduction
DALSA OC-80-04K25-03 Scanning Camera Component Product Features
4K single line array CCD imaging chip, 4096 effective pixels, suitable for precision inspection of semiconductor wafer appearance
25kHz standard line scanning frequency, synchronized matching wafer transport high-speed motion, no dragging or distortion
80 μ m large photosensitive pixel size, high sensitivity, clear and uniform imaging in low light chamber environment
Built in TDI integral imaging mode, multi-stage integration improves signal-to-noise ratio, captures small scratch particle defects
Camera Link standard data interface, high-speed lossless image transmission, compatible with industrial control image acquisition cards
Support hardware pixel merging, mirroring, flat field correction, and one click elimination of uneven brightness and darkness in the image
Integrated optocoupler isolation trigger input, can be connected to pre alignment, servo encoder synchronous imaging timing
Metal fully shielded body, multi-layer EMI filtering, resistant to RF electromagnetic signal interference from etched cavities
M72 standard lens interface, can be paired with a telecentric lens to meet the requirement of distortion free imaging at the edge of the wafer
12-15V DC wide power supply, low-power operation, long-term continuous operation with low temperature rise
Multiple sets of status indicator lights on the body, visually displaying power, trigger, data transmission, and fault status
0~50 ℃ industrial wide temperature element device, clean room 7 × 24-hour uninterrupted stable image acquisition
Compact integrated structure, reserved standard installation holes, can be directly integrated into wafer inspection stations
Equipped with specialized debugging software, supporting real-time online adjustment of gain, exposure, and offset parameters
Low release dust-free shell material, no dust precipitation, in compliance with semiconductor cleanroom usage standards
The DALSA OC-80-04K25-03 scanning camera component is a specialized line array vision unit for detecting wafer surface defects and edge contours. It has high imaging accuracy and strong synchronization, and is suitable for 300mm semiconductor machine vision inspection systems.
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