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  • Yaskawa XU-ACP130-B11 wafer pre aligner
  • Yaskawa XU-ACP130-B11 wafer pre aligner
  • Yaskawa XU-ACP130-B11 wafer pre aligner
Yaskawa XU-ACP130-B11 wafer pre aligner Yaskawa XU-ACP130-B11 wafer pre aligner Yaskawa XU-ACP130-B11 wafer pre aligner

Yaskawa XU-ACP130-B11 wafer pre aligner

Yaskawa XU-ACP130-B11 wafer pre aligner        

Yaskawa XU-ACP130-B11 wafer pre alignertails Introduction

Yaskawa XU-ACP130-B11 wafer pre aligner product features

beginning

Yaskawa XU-ACP130-B11 is a specialized wafer pre aligner for 300mm semiconductor equipment. With the high-precision drive of Yaskawa servo, it quickly completes wafer notch positioning and is suitable for continuous production of lithography, etching, and thin film machines.

Compatible with 12 inch standard wafers, compatible with various types of silicon wafers with notches, and highly versatile

Built in high-precision servo motor, with high repeatability and minimal deviation in rotational positioning

Optical sensing detects gaps, with fast recognition speed and reduced processing time for a single wafer

Low friction load-bearing platform, stable adsorption, and no wafer scratches during transportation

Compact and lightweight body, small overall size, saving installation space in equipment compartments

Supports EtherCAT and RS232 industrial communication, seamlessly integrates with device control systems

Closed loop position feedback control, real-time correction of offset, and elimination of abnormal alignment errors

Clean grade dust-free design, no dust falling, ensuring wafer production yield

Multiple hardware security protections, combined with an emergency stop circuit, prevent wafer damage caused by collision

Stable operation over a wide temperature range, with no degradation in alignment performance under high and low temperature environments in the workshop

Anti vibration reinforced structure, mechanical arm transportation shaking does not affect detection accuracy

Visual fault self inspection, real-time feedback of induction, servo, and adsorption abnormal signals

Modular disassembly and assembly structure, with individual disassembly of core components, saving time for maintenance and replacement

Low noise smooth operation, start stop buffer control, no impact damage to wafer edges

Compliant with semiconductor RoHS clean and environmentally friendly standards, suitable for compliance requirements of high-end production lines

ending

The Yaskawa XU-ACP130-B11 wafer pre aligner combines high precision, high efficiency, and clean durability, making it an essential alignment core component for 12 inch wafer processes.

Product imag

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