Gasonics 12-300000-30 Microwave Power Module

Gasonics 12-300000-30 Microwave Power Module

Product Details Introduction

The Gasonics 12-300000-30 microwave power module is a high-frequency power generation and control component specifically designed for Gasonics plasma stripping systems. It is mainly responsible for providing stable and accurate microwave energy to the plasma reaction chamber to achieve efficient and uniform plasma excitation and maintenance. This module is one of the key core components in the plasma processing system.

1、 Product Overview

Product Name: Microwave Power Module

Part number: 12-300000-30

Applicable equipment: Gasonics PEP/Aura plasma stripping system

Functional positioning: Provide microwave excitation power (usually 2.45 GHz) to drive the reaction chamber to generate plasma

This module is typically used in Gasonics systems that use microwave plasma sources, such as the Aura 3000 series or high-power stripping equipment.

2、 Main technical functions

Functional classification description

Microwave power output generates stable high-frequency power of 2.45GHz, with a general power range of 600W-1200W (depending on the device model)

The power regulation function supports automatic power regulation, pulse mode, or constant output mode (CW mode)

Communication with the control system can receive control signals such as startup and power setting sent by the main control system

The protection mechanism has self checking and protection functions for faults such as overheating, high reflected power, and abnormal voltage

3、 Typical application scenarios

Application Location Description

Plasma cavity excitation source microwave power couples energy to the processing cavity through waveguide or antenna, generating plasma

Polymer exfoliation/ashing treatment is suitable for processes such as photoresist removal and cavity cleaning, with minimal impact on heat sensitive devices

The plasma temperature excited by microwave in low loss material processing is relatively low, making it suitable for advanced wafer material processes (such as low-k media)

Product imag

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