TEL Tokyo Electron 3381-0000065-13 PCB substrate

TEL Tokyo Electron 3381-0000065-13 PCB substrate

Product Details Introduction

TEL Tokyo Electron 3381-0000065-13 PCB substrate

Type: Function Control Board/Interface or Logic PCB

Manufacturer: Tokyo Electron Ltd. (TEL)

1、 Product Function Overview

This substrate is a specialized circuit board inside TEL semiconductor equipment, typically used for:

Signal Relay and Distribution: As a bridge circuit board between the main control system and the lower level execution unit

Data processing and logic control: may integrate partial control logic or signal processing functions

I/O interface expansion: Provides external interfaces to connect sensors, drivers, valve controllers, etc

Power management: perform local power conversion, filtering, protection and other functions

⚙️  This PCB usually belongs to the "middle layer" module in the device, responsible for the functional interface tasks of a specific subsystem of the device.

2、 Typical application areas

1. CVD/ALD system control part

Control gas proportional valve, vacuum pump start signal, hot plate heater, etc

Collect sensor signals such as temperature and air pressure, and perform pre conditioning

2. The power/interface submodule of the Etch system

Realize signal bridging between RF power module and process control system

Manage RF matching network and power switch module

3. Wafer handling platform and Loadlock system

Control the input and output channels of vacuum doors, lifting platforms, and displacement sensors

Support action sequence control, status feedback, and action feedback

4. Cleaning or drying system

Control sub modules such as pumps, nozzles, and chemical supply systems

Realize signal detection and linkage execution of liquid level, temperature, and pressure

3、 Product technical characteristics (refer to TEL standard PCB architecture)

Characteristic description

Multi layer board design supports complex wiring and shielding layers, enhancing anti-interference capability

Industrial grade components use highly reliable capacitors, inductors, chips, and interface devices

Digital/analog hybrid support with both logic control and analog signal conditioning functions

High reliability interfaces include inter board connectors, multi pin signal interfaces, cold pressed terminals, etc

Product imag

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