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  • KLA Tencor 720-23475-000 Controller Module
  • KLA Tencor 720-23475-000 Controller Module
KLA Tencor 720-23475-000 Controller Module KLA Tencor 720-23475-000 Controller Module

KLA Tencor 720-23475-000 Controller Module

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  • Delivery date: stock
  • The quality assurance period: 365 days
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KLA Tencor 720-23475-000 Controller Module

Product Details Introduction

The KLA Tencor 720-23475-000 controller module is one of the core control units designed specifically for advanced semiconductor detection and measurement equipment in KLA Tencor. It is usually integrated into high-precision systems, used to coordinate the operation of mechanical, optical, electrical, and data processing subsystems, and is the central component for system logic control and real-time feedback.


1、 Product Overview

Model: 720-23475-000


Type: Controller Module


Platform: KLA Tencor 720 Series


Function: Perform system control tasks, signal management, data processing, communication coordination


2、 Product application areas

1. Wafer defect detection system

Control the motion of the scanning platform, coordinate the rhythm of image acquisition with the laser/optical path.


Collaborate with the image processing module to achieve defect analysis, labeling, and classification.


2. Automatic Optical Inspection (AOI) equipment

Used to coordinate the synchronization of image acquisition heads, lighting systems, and platform positioning units.


Control the trigger signal of the high-speed camera to ensure no frame loss during the scanning process.


3. Morphology and thickness measurement system

Drive the interferometric measurement head, control the Z-axis or tilt axis movement, and achieve nanoscale thickness scanning.


Supports high-frequency data acquisition and closed-loop feedback, suitable for dynamic process control.


4. Electron beam detection or post lithography detection system

As the main control part of the device, it executes e-beam path control, deflection logic, and collaborative processing with the sample platform.


Collaborate with high-speed sampling cards to achieve imaging and processing task scheduling.


5. Wafer handling and automatic alignment system

Control the actions of the robotic arm, vacuum suction cup, rotating device, etc., to achieve the functions of alignment, transportation, and switching of blades.


Realize rapid response, safety interlocking, and process continuity.

Product imag

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