TEL 5085-408084-11 Hot and Cold Plate

TEL 5085-408084-11 Hot and Cold Plate 

 Introduction

TEL 5085-408084-11 Hot and Cold Plate

Product Features:

1. Built in channel structure, capable of rapid temperature rise and fall, precise control of wafer surface temperature

2. The flatness of the board surface is high, and it adheres evenly to the wafer, ensuring the consistency of the entire wafer process

3. Integrated temperature sensing probe, real-time feedback of board temperature, convenient for closed-loop control of the machine

4. The surface is treated with corrosion resistance, which can withstand the erosion of process gases and have a longer service life

5. Standardized installation interface, easy on-site replacement, no need to modify the original pipeline of the machine

Product Parameters:

1. Material model: 5085-408084-11

2. Temperature control method: fluid circulation cold and hot switching

3. Load capacity specification: Suitable for 8-inch wafers

4. Temperature sensor: Built in Pt100 temperature sensor

5. Compatible equipment: TEL etching semiconductor process machine

Application fields:

1. Temperature control of semiconductor dry etching wafer substrate

2. Plasma process wafer constant temperature carrier

3. Rapid heating and cooling of wafers in thin film etching process

4. Uniformity control of wafer etching process

5. Replacement and maintenance of spare parts for TEL machine platform crystal round table cold and hot plates

This TEL 5085-408084-11 hot and cold plate is the core component of the etching machine table crystal circle carrier. It relies on fluid circulation to achieve precise temperature control, stabilize the wafer processing environment, and can be directly replaced on the machine by checking the model.

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