Yaskawa 0190-41805 wafer pre aligner

Yaskawa 0190-41805 wafer pre aligner

 Introduction

Yaskawa 0190-41805 Wafer Pre Alignment Device Product Features

Yaskawa original factory matching, compatible with AMAT 300mm semiconductor deposition etching machine

CCD linear array optical sensing for non-contact detection of wafer edges and notch markings

Ultra high positioning accuracy, center deviation ≤ 0.1mm, rotation angle error ± 0.03 °

High speed calibration process, with a single wafer alignment time of less than 1.7 seconds, improving production line rhythm

Vacuum adsorption bearing method, attached to silicon wafers and quartz wafers, without edge pinch defects

Servo rotary drive, running smoothly without shaking, suitable for ultra-thin and fragile wafers

Cleanroom ISO1 standard body, low release material, to avoid wafer particle contamination

Built in multiple vacuum monitoring, automatic leak alarm to prevent wafer from falling and being damaged

Integrated shielding structure, resistant to cavity RF electromagnetic interference, stable sensing

Modular disassembly and assembly design, quick disassembly of the entire machine, reducing downtime for maintenance

Supports both gap and flat edge wafer benchmark recognition, compatible with multiple process wafers

Supporting machine bus communication, real-time uploading of alignment data to the main control system

Low dust sealed bearings, continuous operation in a clean workshop for 7 × 24 hours for a long time

Equipped with a fault status indicator light, quickly locate vacuum, sensor, and motor abnormalities

Compact and miniaturized body, suitable for installation space in narrow transmission chambers inside devices

Yaskawa 0190-41805 wafer pre aligner is a core calibration unit for 300mm wafer transfer, with high accuracy and excellent cleanliness, ensuring stability in handling and process.

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