KLA Tencor 36-0201 Main Interface Board
Product Details Introduction
1、 Basic Information
Product model: 770-809195-000
Manufacturer: KLA Tencor
Product type: Image Processor Module
Main purpose: Used in semiconductor testing equipment for high-speed processing and analysis of collected image data
2、 Function Description
Real time high-speed image data processing
Support complex image analysis algorithms such as defect detection, image enhancement, filtering, etc
Provide high bandwidth data transmission interface to ensure image processing efficiency
Collaborate with other modules of the detection equipment to improve overall detection performance
Supports multiple image input formats and interface standards
3、 Technical parameters (reference)
Processing capability: High performance image processing chip, supporting multi-threaded parallel computing
Interface type: High speed data interface (such as Camera Link, LVDS, or dedicated bus interface)
Input format: Multiple digital image formats supported
Working voltage: Depending on the equipment specifications, it is generally 12V or 24V DC
Working temperature range: industrial grade temperature adaptation, usually from 0 ℃ to+60 ℃ or wider
Size specifications: comply with the internal installation requirements of the equipment, and the specific size depends on the equipment design
4、 Application Fields
Semiconductor wafer defect detection system
Electron microscope image acquisition and processing
Precision optical testing equipment
Other industrial inspection systems that require high-speed image processing
5、 Advantages and Characteristics
High speed parallel processing capability enhances detection speed
Multi functional image algorithm support enhances detection accuracy
Good system compatibility, easy to integrate into existing devices
Industrial grade design, suitable for harsh working environments
Product imag

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