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  • TEL BB87-002909 RF Matching Unit
  • TEL BB87-002909 RF Matching Unit
  • TEL BB87-002909 RF Matching Unit
TEL BB87-002909 RF Matching Unit TEL BB87-002909 RF Matching Unit TEL BB87-002909 RF Matching Unit

TEL BB87-002909 RF Matching Unit

TEL BB87-002909 RF Matching Unit

Product Introduction

TEL BB87-002909 is an RF matching unit for Tokyo Electronic Semiconductor Equipment, which automatically adjusts impedance, reduces RF reflection power, and stabilizes plasma discharge.

Product Features

1. Dynamic automatic impedance matching to reduce RF echoes

2. Fast response speed, adaptable to changes in plasma load

3. Equipped with arc pulling, overload protection, and protection against RF power supply

4. Original integrated structure, can directly replace spare parts

5. Suitable for vacuum clean chambers, suitable for long-term process operation

Application Fields

1. RF impedance matching of semiconductor etching cavity

2. RF circuit matching for PVD thin film deposition equipment

3. RF system adjustment of plasma cleaning equipment

4. Plasma process matching for wafer processing chamber

5. Maintenance and replacement of TEL equipment RF matching unit

6. Impedance matching of vacuum coating plasma process

7. Use of plasma surface treatment equipment for materials

8. RF matching of research plasma experimental equipment

9. Display panel plasma process matching

10. Renovation of old semiconductor plasma equipment

TEL BB87-002909 matches the impedance of the RF circuit to ensure stable plasma process, and is a commonly used spare part for semiconductor equipment.

Product imag

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