YASKAWA XU-DSCC0200-E servo drive
Introduction
YASKAWA XU-DSCC0200-E servo drive
Product Features
High response position closed-loop control achieves smooth micro level positioning motion
Built in vibration suppression algorithm reduces machine operation jitter and protects wafers
Equipped with overload, overvoltage, and overheating alarm protection to ensure continuous operation of the machine
Supports high-speed bus communication for quick integration with semiconductor equipment control systems
The compact card structure is easy to disassemble and assemble, making it convenient for on-site replacement of spare parts
Application Areas
Motion Drive Control of Semiconductor Wafer Handling Robot
Wafer lifting platform servo power drive unit
Control of displacement mechanism for PVD coating equipment cavity
Plasma etching machine stage servo drive
Replacement and maintenance of servo spare parts for semiconductor production lines
Refurbishment and renovation of chip equipment with accompanying motion control
Research and development of precision displacement platform drive for experimental machines
Control of sample transfer mechanism for wafer testing equipment
Ion implantation equipment wafer box conveying servo control
Precision stage position adjustment of polishing equipment
The servo drive model for semiconductor precision motion control is YASKAWA XU-DSCC0200-E.
Product imag

ontroller Module
ICSI08E4 FPR3316401R0016 Logical order module
PFSK101 YM322001-ED Logical order card
PFSK111 5735175-C Output channel card
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