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  • YASKAWA YR-CRJ3-A00 Robot Arm
  • YASKAWA YR-CRJ3-A00 Robot Arm
  • YASKAWA YR-CRJ3-A00 Robot Arm
YASKAWA YR-CRJ3-A00 Robot Arm YASKAWA YR-CRJ3-A00 Robot Arm YASKAWA YR-CRJ3-A00 Robot Arm

YASKAWA YR-CRJ3-A00 Robot Arm

YASKAWA YR-CRJ3-A00 Robot Arm 

 Introduction

YASKAWA YR-CRJ3-A00 clean wafer handling robotic arm, commonly used for replacing spare parts in semiconductor equipment EFEM units.

5 product features:

1. Clean arm design, low particle release, suitable for wafer transfer in ultra clean workshops.

2. Direct drive servo transmission, with minimal motion vibration and stable positioning during high-speed operation.

3. Supports single arm telescopic operation and can be paired with a vacuum nozzle to complete wafer retrieval and placement.

4. Equipped with collision force detection, it can quickly stop when touching foreign objects and protect the wafer from damage.

5. The interface and installation position are factory standardized, and on-site disassembly and replacement are simple.

5 product parameters:

1. Suitable for 200mm wafer handling.

2. Repetitive positioning accuracy ± 35 μ m.

3. DC48V servo power supply.

4. Ethernet with IO signal and machine interaction.

5. The working environment temperature is 18-28 ℃.

5 application areas:

1. Semiconductor EFEM front-end module wafer transfer.

2. Glue coating and developing track machine for wafer loading and unloading.

3. The wafer box automatically picks up and places wafers at the process station.

4. Automated handling unit for detection and measurement equipment.

5. Replacement of old semiconductor equipment mechanical arm malfunction.

Overall, YASKAWA YR-CRJ3-A00 belongs to the category of equipment specific clean robotic arms. There are many refurbished parts available on the market, and accuracy calibration needs to be completed before installation to confirm compatibility with the controller software version.

Product imag

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