TEL 3D81-000102-V1 interface module

TEL 3D81-000102-V1 interface module

 Introduction

TEL 3D81-000102-V1 Interface Module Product Features

TEL 3D81-000102-V1 is compatible with Tokyo Electronics etching, coating and developing semiconductor equipment, responsible for signal transfer of various subsystems

Multi channel IO communication channel, synchronously transmitting sensor and actuator signals

Optocoupler isolation circuit, shielding RF and motor electromagnetic interference

Standard backplane slot, easy to disassemble and replace

Hardware watchdog, automatically resets and restores the link in case of communication abnormalities

Integrated overvoltage, overcurrent, and electrostatic multiple circuit protection

Onboard indicator light, with visible power on, communication, and fault status

Three proof coating for the whole board, dust-proof, moisture-proof and corrosion-resistant in the clean room

Welding point reinforcement process, cavity vibration is less prone to virtual welding and wire breakage

The constant temperature clean room can operate continuously and stably for 24 hours

Match TEL original equipment bus, directly connected to the main control without the need for transfer

Local storage of fault logs for easy maintenance and traceability

Reserved testing probe points for convenient line verification and troubleshooting

Compact and elongated version, with multiple stacked boards in the cabinet to save space

Original factory positioning interface, no need to modify the wiring for replacement assembly

TEL 3D81-000102-V1 interface module has stable signal transmission and convenient operation and maintenance. It is a dedicated signal adapter board for TEL wafer process equipment

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