YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device

YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device        

Product Details Introduction

YASKAWA XU-ACP130-B01 Wafer Pre Alignment Device

YASKAWA XU-ACP130-B01 is suitable for precise positioning of 300mm silicon wafers

Vacuum adsorption fixes the wafer without scratching the edges of the wafer

Red light CCD sensor for rapid identification of wafer notches and flat edges

Servo direct drive rotation, high angle alignment accuracy

Short single calibration time, improving production line circulation efficiency

The whole machine is made of low dust material and meets the cleanliness standards of dust-free workshops

Built in vacuum detection, automatic trigger alarm for missing chips

Small integrated body, suitable for devices with narrow installation positions

Support calibration of silicon wafer and quartz wafer materials

20 bit high-precision encoder with no positioning deviation during rotation

Stable air pressure, vacuum supply adaptation, and minimal operational fluctuations

Anti workshop electromagnetic interference, stable and reliable data transmission

Interlockable robotic arm controller, easy to integrate and debug

Fully sealed structure for dust and moisture prevention, long-lasting durability

Multiple point calibration is completed at the factory, eliminating the need for repeated on-site debugging

In summary, the YASKAWA XU-ACP130-B01 wafer pre aligner has high accuracy, cleanliness, and durability, making it a standard positioning accessory for 300mm semiconductor processes

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