Hamamatsu C8779A-01 Heat Pump Compressor
Product Details Introduction
Hamamatsu C8779A-01 Scanning Camera Unit Product Features
beginning
Hamamatsu C8779A-01 is a dedicated CCD precision scanning unit for Hamamatsu's original semiconductor lithography machine. It has high imaging accuracy and is compatible with Nikon's step scanning lithography equipment. Its core features are as follows:
Equipped with the original S8769A linear CCD photosensitive chip, the low light imaging is clear
High speed synchronous scanning and reading, matching the continuous processing cycle of the production line
Integrated optical path module, long-term use without offset of optical path
All metal sealed dustproof shell, suitable for clean and dust-free workshops
Multiple sets of standard DB industrial interfaces, directly connected to the main control system of the lithography machine
Accurate electronic shutter, synchronized wafer scanning timing without deviation
Anti halo circuit, no image overflow in high light areas
Low dark current design, low noise during long-term scanning of images
Integrated metal heat dissipation structure, continuous operation with controllable temperature rise
Built in dual protection against static electricity and overvoltage, protecting the photosensitive chip
Standardized fixed base, easy to disassemble and calibrate operation
Layered wiring of strong and weak electricity to resist electromagnetic interference in the workshop
Factory optical calibration with minimal imaging positioning error
Perfectly compatible with Nikon NSR-S610C lithography machine, with strong compatibility
Modular split structure, faulty components can be replaced and repaired separately
ending
Hamamatsu C8779A-01 has stable imaging and complete protection, and is a core high-precision optical scanning accessory for semiconductor lithography detection equipment.
Note: This model is not a heat pump compressor, but rather a photolithography CCD scanning imaging unit.
Product imag

ontroller Module
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Bently 3500/72M 176449-08 Monitoring Module
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