Olympus IX71S1F-3 Robot Controller
Product Details Introduction
Olympus IX71S1F-3 Electric Microscopy Imaging Control Unit Product Features
Olympus IX71S1F-3 is an integrated electronic control base for Olympus fully automatic inverted fluorescence microscope, which integrates stage, optical path, and shutter motion control. It is commonly used for semiconductor wafer micro inspection and material micro analysis equipment matching.
Original factory UIS infinite distance optical rack, with a rigid body and no offset in the optical path under temperature changes
Equipped with electric XY/Z three-axis stage, nanometer level focusing and repetitive positioning accuracy
Integrated electronic control, filter wheel, fluorescent shutter, objective lens switching drive
Low vibration silent servo drive, high-speed movement without damaging the surface of the wafer sample
Multi channel fluorescence light path control, supporting automatic switching of multi band excitation
Front facing physical operation buttons, paired with upper level software for dual-mode control
Digital signal closed-loop feedback, real-time feedback of carrier coordinates and optical path status
Standard serial/network communication, integrated with the main control of the testing machine for imaging linkage
Multiple hardware protections: automatic shutdown and locking for overtravel, overload, and overheating
Anti static coating for the whole machine, suitable for use in dust-free wafer testing stations
Power off to save focus coordinates and optical path parameters, restart without recalibration
Layered multi-channel isolation circuit, shielding equipment from radio frequency electromagnetic signal interference
Modular electric components, carrier and optical drive unit can be replaced separately
High signal-to-noise ratio fluorescence optical path design, no impurities in micro defect imaging
Compatible with various sample carrier specifications such as culture dishes, wafers, and glass slides
OLYMPUS IX71S1F-3 is a core imaging control machine for semiconductor appearance inspection and material microscopic analysis, achieving fully automatic high-precision microscopic scanning inspection.
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