Genmark Logosol MC-21-1007 Printed Circuit Board

Genmark Logosol MC-21-1007 Printed Circuit Board        

Product Details Introduction

Genmark Logosol MC-21-1007 Printed Circuit Board Product Features

The Genmark Logosol MC-21-1007 is a three-axis DSP main control board for wafer handling robots, which is matched with the Genmark 6550 series robot motherboard to control pre alignment and wafer transfer motion signals.

Original factory matching MC21 series three-axis motion control motherboard, direct insertion type daughter board does not require wiring changes

High density multi-layer gold-plated circuit with extremely low transmission loss of servo pulse signals

Integrated encoder signal acquisition channel, reading feedback data on the position of the wafer cone

Independent optoelectronic isolation circuit, isolating cavity RF electromagnetic interference

Built in hardware filtering circuit to suppress the interference of mechanical arm motion noise

Multiple circuit protection against overcurrent, short circuit, and electrostatic breakdown

Onboard status indicator light, quickly locate communication and motor faults

The storage chip retains the motion process parameters of the robotic arm, ensuring that they are not lost during power outages

Standard gold finger slot, modular insertion and replacement, time-saving and convenient

Clean grade heat-resistant PCB substrate, suitable for semiconductor dust-free workshops

Reinforced solder pad routing, mechanical arm reciprocating vibration is not easy to solder off

Multi channel IO point linkage vacuum adsorption and wafer detection sensors

Low latency signal output, rapid response to platform start stop and positioning

Factory motion signal calibration, directly adapted for mass production of robotic arms on the machine

Compatible with Logosol LPA wafer pre alignment equipment for collaborative communication

The Genmark Logosol MC-21-1007 printed circuit board is the core signal sub board of the semiconductor wafer manipulator, ensuring precise and stable wafer transfer and pre alignment positioning.

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