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  • TEL Tokyo Electron 2L08-05006-12 Printed Circuit Board
  • TEL Tokyo Electron 2L08-05006-12 Printed Circuit Board
TEL Tokyo Electron 2L08-05006-12 Printed Circuit Board TEL Tokyo Electron 2L08-05006-12 Printed Circuit Board

TEL Tokyo Electron 2L08-05006-12 Printed Circuit Board

TEL Tokyo Electron 2L08-05006-12 Printed Circuit Board

Product Details Introduction

Tokyo Electron (TEL) 2L08-05006-12 Printed Circuit Board - Detailed Explanation of Product Application Fields


1、 Product functional positioning

The 2L08-050066-12 printed circuit board (PCB) is a critical electronic component in Tokyo Electron semiconductor equipment, typically used to carry functional modules such as control logic, power distribution, and signal processing. It serves as the foundational platform for internal signal and power transmission within the equipment.


2、 Main application areas

1. Core circuit support for equipment control system

Used as a motherboard or daughter board for control systems, carrying key components such as MCU, FPGA, I/O control chips, etc;


Implement logical control and state coordination of various subsystems in wafer processing equipment (such as etching machines, CVD, coating and developing machines).


2. Signal acquisition and interface conversion

Integrate multiple sensor interfaces, AD/DA modules, and communication ports;


Act as a bridge in the device, connecting the execution components such as temperature control system, air pressure control, motor drive module, etc. with the central controller.


3. Power allocation and voltage regulation filtering function

Carrying power modules and stabilizing circuits, providing stable low-voltage DC power for other functional boards;


Realize the allocation of different voltage levels, overload protection, and electromagnetic interference suppression.


4. System communication and bus integration

Provide internal communication bus interfaces such as I ² C, SPI, RS-485, CAN, etc;


Support high-speed data exchange between the main control system and external devices.


3、 Typical application devices

Plasma etching system (Etcher)

Control gas flow rate, electrode voltage, vacuum system and other aspects.


Thin film deposition equipment (CVD, ALD)

Manage process parameters such as temperature, time, and reactant injection.


Coater/Developer

Used to control rotation speed, development time, exposure area recognition, etc.


Device communication relay and data distribution node

Can serve as a communication node for multiple sub modules within the system, improving data coordination efficiency.

Product imag

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