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  • TEL Tokyo Electron 3M81-003092-11 Interface Module
  • TEL Tokyo Electron 3M81-003092-11 Interface Module
TEL Tokyo Electron 3M81-003092-11 Interface Module TEL Tokyo Electron 3M81-003092-11 Interface Module

TEL Tokyo Electron 3M81-003092-11 Interface Module

  • Goods status: new/used
  • Delivery date: stock
  • The quality assurance period: 365 days
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TEL Tokyo Electron 3M81-003092-11 Interface Module

Product Details Introduction

The TEL Tokyo Electron 3M81-003092-11 interface module is an important electronic module used in semiconductor manufacturing equipment. Its main function is to serve as a signal interface bridge between various control units of the equipment, enabling communication and signal conversion between different modules, ensuring the coordination and stability of equipment operation.


1、 Basic Information

Model: 3M81-003092-11


Name: Interface Module


Manufacturer: Tokyo Electron Ltd. (TEL)


Purpose: Signal transmission and interface conversion, connecting the main control board with peripheral I/O modules or other subsystems


2、 Main functions

Signal switching and conversion


Transferring signals from control units or sensors to execution units or upper level systems, which may include processing of digital and analog signals.


Communication protocol adaptation


Support different communication interface standards, achieve protocol compatibility and data format conversion.


Signal isolation and protection


Provide electrical isolation and anti-interference protection to ensure stable operation of the system.


Standardization of interfaces between modules


Standardize the interfaces of different modules to facilitate modular design and maintenance of equipment.


3、 Typical application areas

Semiconductor process equipment control system


Used as a control signal interface for CVD, etching, coating and development equipment, coordinating subsystems such as gas control, motion control, temperature control, etc.


Device I/O Expansion


Realize the extended acquisition and output of digital and analog signals for devices.


System communication bridge


Connect CPU modules, I/O modules, sensors, and actuators to achieve data flow.

Product imag

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