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  • TEL Tokyo Electron 3884-200219-31 CPU module
  • TEL Tokyo Electron 3884-200219-31 CPU module
  • TEL Tokyo Electron 3884-200219-31 CPU module
TEL Tokyo Electron 3884-200219-31 CPU module TEL Tokyo Electron 3884-200219-31 CPU module TEL Tokyo Electron 3884-200219-31 CPU module

TEL Tokyo Electron 3884-200219-31 CPU module

  • Goods status: new/used
  • Delivery date: stock
  • The quality assurance period: 365 days
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TEL Tokyo Electron 3884-200219-31 CPU module

Product Details Introduction

The TEL Tokyo Electron 3884-200219-31 CPU module is a core control unit used in semiconductor manufacturing equipment, mainly responsible for system operations, signal processing, equipment control, and other functions. It belongs to the brain part of the equipment. This module is typically integrated into the main control framework of TEL, used to coordinate and manage various subsystems such as gas control, temperature control, motion control, etc.


1、 Basic Product Information

Model: 3884-200219-31


Product Name: CPU Module/Central Processing Module


Manufacturer: Tokyo Electron (TEL)


Adaptation platform: TEL dedicated semiconductor equipment, such as deposition equipment (CVD), etching machines, cleaning equipment, etc


2、 Function and Function

Central Processing Unit


Manage all device sub modules, such as gas flow control, power system, I/O interfaces, user interfaces, etc.


Run device control software to achieve sequential logic and real-time task scheduling.


I/O signal management


Communicate with peripheral devices through buses such as VME, PCI, PXI, etc.


Receive sensor signals and control actuator actions.


Communication with Human Machine Interface (HMI)


Provide interface support for status display, alarm, parameter settings, etc.


Running the operating system


May run embedded real-time operating systems (such as VxWorks, QNX, or TEL custom RTOS), supporting stable control performance.


3、 Typical application areas

Thin film deposition equipment (CVD/PVD)


Control the reaction temperature, gas flow rate, and vacuum environment to ensure deposition uniformity.


Plasma etching equipment (Etchers)


Real time monitoring of cavity status and dynamic adjustment of etching parameters.


Cleaning equipment (Wet Bench)


Manage liquid chemicals, pump valve switching, tank temperature control, etc.


Measurement and detection module


Coordinate functions such as image processing, signal acquisition, and measurement data transmission.

Product imag

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