TEL Tokyo Electron 308-600044-2 Backplane Interface Board

TEL Tokyo Electron 308-600044-2 Backplane Interface Board

Product Details Introduction

Product Name: 308-600044-2 Backplane Interface Board

Manufacturer: Tokyo Electron Ltd

Product type: Backplane Interface Board

1、 Product Overview

308-600044-2 is a backplane interface board used for system level signal and power transmission in TEL semiconductor equipment. It belongs to the core connection platform and is used to connect multiple sub boards (control board, I/O board, power board, etc.) to achieve centralized signal management, power distribution, and inter board communication. Usually installed inside the main control frame or modular rack.

2、 Core functions

Module interconnection platform

Provide a unified slot for multiple functional boards, supporting hot swapping or modular replacement.

Ensure a unified transmission path for control logic, signals, and power supply.

Power distribution and grounding management

Distribute the DC power output from the centralized power supply system (such as 24V/12V/5V DC) to each functional board.

Grounding the management system to ensure signal integrity and system stability.

Signal relay and communication bridging

Equipped with data bus, control line, and power line to achieve high-speed communication between boards.

Connect industrial communication protocol signal lines such as RS232, CAN, TTL, etc.

3、 Typical application devices

This backplane interface board is suitable for control racks or main modules of the following Tokyo Electron series devices:

Coater/Developer

Etcher etching equipment

CVD/PVD vacuum thin film deposition equipment

Wafer handling system (Robot/Load Port/Signer)

Gas delivery system, vacuum chamber subsystem

Product imag

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