LAM 839-019090-620 electrostatic clamp

LAM 839-019090-620 electrostatic clamp

Product Details Introduction

839-019090-620 is an electrostatic chuck (ESC) produced by LAM Research, mainly used for clamping and fixing silicon wafers in the semiconductor manufacturing process.

Main features:

High precision clamping: By precisely fixing the silicon wafer with electrostatic force, the stability and positional accuracy of the silicon wafer are ensured during the processing.

Widely applicable: Suitable for semiconductor manufacturing processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), etching, etc.

High reliability: designed to meet the high requirements of semiconductor manufacturing environments, with excellent durability and stability.

Application areas:

This electrostatic clamp is widely used in the semiconductor manufacturing industry, especially in the following processes:

Chemical Vapor Deposition (CVD): Used for depositing thin films on the surface of silicon wafers.

Physical Vapor Deposition (PVD): Used for depositing metals or other materials on the surface of silicon wafers.

Etching: Used for etching patterns on silicon wafers.

Maintenance and replacement:

Long term use may lead to a decrease in the performance of the electrostatic clamp. Regular inspection and replacement of this module can ensure the stability and efficient operation of the semiconductor manufacturing process.

Product imag

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